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Found 3 product(s) for Solder Spheres:Leaded Alloys . Click on product name to proceed (1-3 of 3)
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
