Sn98.5Ag1Cu0.5

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Sn98.5Ag1Cu0.5 (SAC105) Solder Balls

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  • Description & Specs.
Certificate of Conformance for Sn98.5Ag1CU0.5 Solder Spheres

EasySpheres Sn98.5Ag1Cu0.5 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.

Alloy Melt Temperature : 217 - 226 (°C)

CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS


EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.