Leaded Alloys
Leaded Solder Balls for BGA Rework & Semiconductor Packaging
Leaded solder balls are widely used for BGA rework, chip reballing, semiconductor packaging, and legacy electronics. EasySpheres supplies leaded solder spheres in Sn63Pb37, Sn62Pb36Ag02, Sn10Pb90, and Sn5Pb95 alloys for BGA, CSP, flip chip, and controlled-collapse chip connection (C4) applications. EasySpheres also offers these alloys in tape and reel.
Choosing the Right Leaded Solder Alloy
- Applications: BGA rework, CSP, chip reballing, semiconductor packaging, and C4 applications.
- Available Alloys (melting range): Sn63Pb37 (183 °C, eutectic), Sn62Pb36Ag02 (179 °C, eutectic), Sn10Pb90 (~268–302 °C, high-lead), and Sn5Pb95 (~301–314 °C, high-lead).
- Selection: Choose the alloy based on your assembly process, melting characteristics, and application requirements.
- Compliance: Manufactured in conformance with IPC J-STD-006, with a Certificate of Conformance shipped on every order. As leaded (tin-lead) alloys, these are generally not RoHS-compliant as supplied; the high-lead alloys Sn10Pb90 and Sn5Pb95 (≥85% lead) may qualify under RoHS Annex III exemption 7(a). Confirm your intended exemption or application.
Frequently Asked Questions
Where can I buy leaded solder balls for BGA and CSP applications?
EasySpheres supplies leaded solder balls in multiple alloys and diameters for BGA and CSP work. Select the alloy and ball size that match your application.
Where can I order Sn63Pb37 solder spheres in small quantities?
EasySpheres supplies Sn63Pb37 solder spheres in multiple ball sizes for BGA rework, PCB repair, and prototype applications. Choose the diameter required for your assembly process.
What is the difference between eutectic and high-lead solder balls?
Eutectic tin-lead alloys such as Sn63Pb37 (183 °C) and Sn62Pb36Ag02 (179 °C) melt at a single low temperature, suited to standard BGA rework and PCB repair. High-lead alloys such as Sn10Pb90 (~268–302 °C) and Sn5Pb95 (~301–314 °C) stay solid at much higher temperatures, making them suitable for high-temperature interconnects and C4 applications.
Are leaded solder balls RoHS compliant?
Leaded (tin-lead) solder balls are generally not RoHS-compliant as supplied. High-lead alloys such as Sn10Pb90 and Sn5Pb95 (≥85% lead) may qualify under a RoHS Annex III exemption (7(a)). Confirm your intended exemption or application before ordering.
When should I use leaded solder balls instead of lead-free solder balls?
Leaded solder balls are commonly used for legacy electronics, repair, and applications requiring tin-lead solder alloys. The appropriate alloy depends on your product requirements and compliance needs.
Which leaded solder alloy is suitable for flip chip or semiconductor bumping?
High-lead alloys such as Sn10Pb90 and Sn5Pb95 are commonly used for flip chip, semiconductor bumping, and C4 applications that require a high-melting-point joint. Select the alloy recommended for your device and manufacturing process.