Leaded Alloys

Leaded Solder Alloys

Leaded solder balls are used for BGA rework and reballing, semiconductor packaging, flip chip and C4 bumping, and legacy, repair, aerospace, and defense assemblies that specify tin-lead solder. EasySpheres supplies leaded solder spheres in Sn63Pb37, Sn62Pb36Ag02, Sn20Pb80, Sn10Pb90, and Sn05Pb95, in diameters from 0.050 mm to 0.889 mm, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order. Sn63Pb37 and Sn10Pb90 are also available in tape and reel.

Specifications

  • Alloys available (melting): Sn63Pb37 (183 °C eutectic), Sn62Pb36Ag02 (179 °C eutectic), Sn20Pb80 (high-lead), Sn10Pb90 (268 to 302 °C), Sn05Pb95 (301 to 314 °C)
  • Applications: BGA rework and reballing, CSP ball attach, semiconductor packaging, flip chip and C4 bumping, legacy and repair assemblies
  • Stock diameters: 0.050 mm to 0.889 mm
  • Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%.
  • Quality: Alloy purity in conformance with IPC J-STD-006; Certificate of Conformance ships with every order; standard quality documentation available on request.
  • Compliance: Tin-lead alloys are not RoHS-compliant as supplied. The high-lead alloys Sn10Pb90 and Sn05Pb95 (85% or more lead) may qualify under RoHS Annex III exemption 7(a); the customer confirms the exemption applies. Supply is not prohibited; REACH Article 33 disclosure available.
  • Packaging: Medical-grade, ESD-safe containers designed to resist surface darkening from transit tumbling; QR-coded for lot traceability.
  • Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
  • Minimum order: 10,000 spheres
!