Sn05Pb95

Sn05Pb95 High-Temperature Solder Balls

Sn05Pb95 solder balls are a high-lead, high-temperature tin-lead alloy (301 °C solidus, 314 °C liquidus) used for flip chip and C4 bumping and semiconductor packaging where the highest-melting tin-lead joint is required. EasySpheres supplies Sn05Pb95 solder spheres in fine diameters, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order.

Sn05Pb95 Solder Sphere Specifications

• Alloy: Sn05Pb95 (5% tin, 95% lead), high-lead
• Applications: Flip chip and C4 bumping, semiconductor packaging, first-level interconnects requiring the highest tin-lead melting range
• Melting range: 301 °C solidus, 314 °C liquidus
• Listed diameters: 0.005 in (0.125 mm), part number 10-0595-05, and 0.0055 in (0.140 mm), part number 10-0595-055; other diameters in the 0.050 to 0.889 mm range on request
• Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%; inspection illuminance greater than 270 lux.
• Quality: Alloy purity in conformance with IPC J-STD-006 (composition per J-STD-006C); Certificate of Conformance ships with every order.
• Compliance: High-lead alloy (85% or more lead by weight); not RoHS-compliant as supplied. May qualify under RoHS Annex III exemption 7(a) for solders with 85% or more lead; the customer confirms that the exemption applies to the intended application. REACH Article 33 disclosure available.
• Packaging: Medical-grade, ESD-safe containers designed to resist the surface darkening caused by transit tumbling, reducing machine-vision faults in automated ball placement systems; QR-coded for lot conformance traceability and shipping accuracy.
• Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
• Minimum order: 10,000 spheres