Lead Free Alloys

Lead-Free Solder Alloys

Lead-free solder alloys are used for BGA and CSP ball attach, BGA rework, PCB assembly, and semiconductor packaging where RoHS compliance is required. EasySpheres supplies RoHS-compliant lead-free solder spheres in SAC105, SAC305, SAC405, Sn96.5Ag3.5, and low-temperature Sn42Bi58, in diameters from 0.050 mm to 0.889 mm, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order. EasySpheres also supplies tin-lead and high-lead alloys for applications that specify them.

Lead-free solder alloys are available in different compositions, each suited to specific assembly and packaging requirements. Learn more about lead-free solder alloy types and their applications.

  • Lead-Free Solder Alloy Types, Properties and Specifications

    • Alloys available: SAC105 (215 to 227 °C), SAC305 (217 to 219 °C), SAC405 (217 to 220 °C), Sn96.5Ag3.5 (221 °C eutectic), Sn42Bi58 (139 °C eutectic)
    • Applications: BGA and CSP ball attach, BGA rework, flip chip and wafer-level bumping, PCB assembly
    • Stock diameters: 0.050 mm to 0.889 mm
    • Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%.
    • Quality: Alloy purity in conformance with IPC J-STD-006; Certificate of Conformance ships with every order; standard quality documentation available on request.
    • Compliance: RoHS-compliant (Directive 2011/65/EU as amended by (EU) 2015/863) and REACH-compliant; declarations available on request.
    • Packaging: Medical-grade, ESD-safe containers designed to resist surface darkening from transit tumbling; QR-coded for lot traceability.
    • Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
    • Minimum order: 10,000 spheres

    How to Select the Right Lead-Free Solder Alloy for BGA and PCB Applications

    The selection of a lead-free solder alloy depends on the required melting temperature, alloy composition, and electronics assembly process. SAC105, SAC305, and SAC405 are available for different lead-free soldering requirements, while Sn96.5Ag3.5 provides a binary tin-silver option. Sn42Bi58 offers a lower-temperature alternative with a 139 °C eutectic melting point.
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