Sn42Bi58

Low Temp Solder Balls

Sn42Bi58 Low Temp Solder Balls

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  • Description & Specs.
  • Datasheets and SDS
Certificate of Conformance for Sn42Bi58

EasySpheres Sn42Bi58 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.

Alloy Melt Temperature : 139 (°C)

CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS


EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.Text

Download Data Sheet

EasySpheres Technical Data Sheet Sn42Bi58 (2021-Rev6.pdf)

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.