Sn96.5Ag3.5 Solder Balls
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* In Stock items ordered by 2:00 Pacific Time Ship same day !
* Selected sizes chosen below are in STOCK and will ship immediately.
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Description & Specs.
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Datasheets and SDS
EasySpheres SAC350 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature : 221(°C)
CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
| Downloads | Data Sheet | Downloads | SDS Sheet |
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EasySpheres Technical Data Sheet Sn96.5Ag3.5(2023-Ver2.pdf) |
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Sn96.5Ag3.5 SDS Sheet (2021-Ver1.pdf) |
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.