Sn96.5Ag3.0Cu0.5 (SAC 305) Solder Balls
* Add our product to the cart to see pricing.
* In Stock items ordered by 2:00 Pacific Time Ship same day !
* Selected sizes chosen below are in STOCK and will ship immediately.
Buy in Quantity and Save!
* For 1,000,000 Spheres you receive an 88% discount against base price.
* Much larger discounts are available based on quantity ordered.
* Ask for a custom quote for more than 5,000,000.
-
Description & Specs.
SAC305 (Sn96.5Ag3.0Cu0.5) Solder Balls
SAC305 (Sn96.5Ag3.0Cu0.5) solder balls are a lead-free alloy widely used for BGA rework, PCB assembly, and high-reliability electronics. EasySpheres supplies precision SAC305 solder spheres across a range of diameters for both prototype and production applications. Manufactured in conformance with IPC J-STD-006, EasySpheres SAC305 spheres suit lead-free BGA rework, prototype runs, and low-minimum-quantity SAC305 requirements.
Choosing SAC305 Solder Balls
- Applications: BGA rework, PCB assembly, CSP packages, and high-reliability electronics.
- Alloy: Sn96.5Ag3.0Cu0.5 (SAC305) lead-free solder alloy; melting range approximately 217–219 °C (solidus–liquidus).
- Sizes: Stock diameters from approximately 0.05 mm to 0.89 mm (50–890 μm); choose the ball diameter that matches your component and PCB specifications.
- Compliance: Manufactured in conformance with IPC J-STD-006 and RoHS (Directive 2011/65/EU, as amended), with a Certificate of Conformance shipped on every order and standard quality documentation available upon request.
-
Datasheets and SDS
EasySpheres SAC305 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature : 221(°C)
CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
| Download | Data Sheet | Download | SDS Sheet |
|
|
EasySpheres Technical Data Sheet SAC 305 (2023-Rev7.pdf) |
|
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
Frequently Asked Questions
What is the best solder alloy for high-reliability BGA packages?
SAC305 is one of the most widely used lead-free alloys for high-reliability BGA packages, offering a balance of mechanical strength, thermal performance, and RoHS compliance.
What is the melting point of SAC305 solder?
SAC305 has a melting range of approximately 217–219 °C (217 °C solidus, 219 °C liquidus), typical of near-eutectic tin-silver-copper alloys.
Where can I buy SnAgCu (SAC) solder spheres in small quantities?
EasySpheres supplies SnAgCu solder spheres, including SAC305 and SAC405, in multiple ball sizes with low minimum quantities suited to prototype and low-volume production. Select the alloy and diameter that match your application.
Which solder alloy is best for thermal cycling reliability?
SAC305 is commonly used where reliable thermal-cycling performance is required. The best alloy still depends on your operating conditions and application requirements.
SAC305 vs SAC405 solder balls — which should I use?
Choose SAC305 for most BGA assembly and rework applications. SAC405 (Sn95.5Ag4.0Cu0.5) carries higher silver content, which can offer added strength for demanding applications, typically at higher cost. Select based on your design and performance requirements.
