Lead Free Solder Balls from EasySpheres

Sn96.5Ag3.0Cu0.5 | .004 - 0.100mm Diameter Solder Spheres| Part No. 10-3005-04

$38.880
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SKU:
10-3005-04
Availability:
In Stock orders placed by 2:00PM (Pacific Time) will ship same day.
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Bulk discount rates

Below are the available bulk discount rates for each individual item when you purchase a certain amount

  • Buy 20 - 29 and get 25% off
  • Buy 30 - 39 and get 35% off
  • Buy 40 - 49 and get 45% off
  • Buy 50 - 99 and get 55% off
  • Buy 100 - 249 and get 65% off
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  • Buy 500 - 999 and get 83% off
  • Buy 1000 - 1999 and get 88% off
  • Buy 2000 - 3999 and get 90% off
  • Buy 4000 - 4999 and get 91% off
  • Buy 5000 or above and get 92% off

SAC305 0.004 in (0.10 mm) Solder Balls for Flip Chip and Wafer-Level Packaging

SAC305 0.004 in (0.10 mm) solder balls are ultra-fine lead-free spheres used for wafer-level packaging, flip chip bumping, BGA bumping, and chip-scale packaging (CSP). EasySpheres supplies these SAC305 solder spheres in conformance with IPC J-STD-006 for precision microelectronics and semiconductor packaging, with a Certificate of Conformance on every order.

SAC305 0.10 mm Solder Sphere Specifications

  • Alloy: Sn96.5Ag3.0Cu0.5 (SAC305), lead-free
  • Diameter: 0.004 in (0.10 mm)
  • Applications: Flip chip bumping, wafer-level packaging, BGA bumping, CSP ball attach
  • Melting range: 217 °C solidus, 219 °C liquidus
  • Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50%); sphericity deviation less than 1.5%, supporting consistent bump formation
  • Quality: Alloy purity in conformance with IPC J-STD-006; Certificate of Conformance ships with every order; standard quality documentation available on request.
  • Compliance: RoHS-compliant (Directive 2011/65/EU as amended by (EU) 2015/863) and REACH-compliant; declarations available on request.
  • Packaging: Medical-grade, ESD-safe containers designed to resist surface darkening from transit tumbling; QR-coded for lot traceability.
  • Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
  • Minimum order: 10,000 spheres
Warranty Information
EasySpheres warrants this product to be defect free, with a controlled size distribution per specification and an alloy purity which is in compliance of IPC-JSTD-006 guidelines. 



Size deviation shall not be greater than:
å± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)

å± 0.015% for Sizes 0.020" ~ 0.022"  (0.500mm~0.550mm)

å± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)



Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.

Frequently Asked Questions

What are solder spheres used for in flip chip packaging?

Solder spheres form the electrical and mechanical connections between the die and the substrate, providing the first-level interconnect in flip chip packaging.

How do I choose the solder ball size for BGA bumping?

Use the diameter specified for the package and pad layout. For fine-pitch and wafer-level work, 0.10 mm (0.004 in) is a common size; always follow the package documentation.

What size solder balls are used for wafer-level packaging?

Wafer-level packaging commonly uses ultra-fine spheres such as 0.004 in (0.10 mm), depending on the package design. Follow the component manufacturer's specification.

How tight are the tolerances on EasySpheres 0.004 in SAC305 solder balls?

Maximum dimensional tolerance ±4% with typical measured tolerance ±0.50%, and sphericity deviation under 1.5%, supporting consistent, repeatable bump formation.

Which solder alloy is commonly used for wafer-level packaging?

SAC305 is one of the most widely used lead-free alloys for wafer-level packaging, balancing thermal performance, mechanical reliability, and RoHS compliance.

Why Buy Solder Spheres from EasySpheres

  • Fast shipping: most in-stock orders placed before 2:00 PM Pacific ship the same day, otherwise within 24 hours, with a greater-than-95% on-time delivery record.
  • Small quantities welcomed: minimum order 10,000 spheres, with volume supply for production requirements.
  • Certificate of Conformance with every shipment; technical data sheet and SDS available on the product page.
  • Two-year shelf life from the date of shipment; product is held in sealed packaging in a controlled inert storage environment until it ships.
  • Full lot traceability with QR-coded packaging.
  • Serving approximately 1,500 customers worldwide since 2005 across semiconductor packaging, aerospace, defense, medical electronics, EMS, and BGA rework.
  • Internal quality system aligned with ISO 9001:2015 principles (not externally certified); standard quality documentation available on request.

Ordering and Support FAQs

Can I order SAC305 0.10 mm solder spheres in small quantities?

Yes. EasySpheres supplies SAC305 0.10 mm solder spheres with a minimum order of 10,000 spheres and scales to production volumes. Request a quote for larger requirements.

How quickly do SAC305 0.10 mm solder spheres ship?

Most in-stock orders placed before 2:00 PM Pacific ship the same day; other orders ship within 24 hours. EasySpheres maintains a greater-than-95% on-time delivery record.

What documentation ships with SAC305 0.10 mm solder spheres?

A Certificate of Conformance ships with every order, covering alloy composition, solidus and liquidus, size distribution, and sphericity. The technical data sheet and SDS are available on the product page, and standard quality documentation is available on request.

What is the shelf life of SAC305 0.10 mm solder spheres?

The stated shelf life is two years from the date of shipment from the EasySpheres facility. Prior to shipment the product is retained in its original sealed packaging within a controlled inert storage environment designed to minimize exposure to moisture, oxygen, and contaminants.

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