Leaded Solder Spheres: Sn10Pb90

Sn10Pb90 stock diameters and part numbers (17 sizes)

Diameter (mm)	Diameter (in)	Part number
0.100	0.004	10-1090-04
0.125	0.005	10-1090-05
0.150	0.006	10-1090-06
0.175	0.007	10-1090-07
0.200	0.008	10-1090-08
0.250	0.010	10-1090-10
0.300	0.012	10-1090-12
0.350	0.014	10-1090-14
0.400	0.016	10-1090-16
0.450	0.018	10-1090-18
0.500	0.020	10-1090-20
0.559	0.022	10-1090-22
0.600	0.024	10-1090-24
0.635	0.025	10-1090-25
0.700	0.028	10-1090-28
0.760	0.030	10-1090-30
0.890	0.035	10-1090-35

Order from 10,000 spheres. Other diameters from 0.050 to 0.889 mm on request. Also available in tape and reel, 0.300 to 0.760 mm.

Sn10Pb90 High-Temperature Solder Balls

Sn10Pb90 solder balls are a high-lead, high-temperature tin-lead alloy (268 °C solidus, 302 °C liquidus) used for flip chip and C4 bumping, semiconductor packaging, hierarchical soldering, and aerospace and defense assemblies that require a high-melting-point joint. EasySpheres supplies Sn10Pb90 solder spheres in multiple diameters and in tape and reel, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order.

Sn10Pb90 Solder Sphere Specifications

Alloy: Sn10Pb90 (10% tin, 90% lead), high-lead
Applications: Flip chip and C4 bumping, semiconductor packaging, BGA and CSP ball attach requiring a high-melting-point joint, hierarchical (step) soldering, aerospace and defense assemblies
Melting range: 268 °C solidus, 302 °C liquidus
Stock diameters: 0.050 mm to 0.889 mm range; see the product listing for diameters and part numbers. Also available in tape and reel, 0.300 mm to 0.760 mm.
Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%; inspection illuminance greater than 270 lux.
Quality: Alloy purity in conformance with IPC J-STD-006 (composition per J-STD-006C); Certificate of Conformance ships with every order.
Compliance: High-lead alloy (85% or more lead by weight); not RoHS-compliant as supplied. May qualify under RoHS Annex III exemption 7(a) for solders with 85% or more lead; the customer confirms that the exemption applies to the intended application. REACH Article 33 disclosure available.
Packaging: Medical-grade, ESD-safe containers designed to resist the surface darkening caused by transit tumbling, reducing machine-vision faults in automated ball placement systems; QR-coded for lot conformance traceability and shipping accuracy.
Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
Minimum order: 10,000 spheres

Sn10Pb90 vs. Sn63Pb37: Alloy Selection for BGA Assembly

Sn10Pb90 and Sn63Pb37 are tin-lead solder alloys used for different assembly requirements. The key difference is their melting behavior, which affects alloy selection when an assembly involves multiple soldering stages. Sn10Pb90 has a higher melting range, while Sn63Pb37 melts at a single temperature. The package and assembly specifications should determine which alloy is appropriate.

Comparison factor	Sn10Pb90	Sn63Pb37
Melting behavior	Solidus 268 °C; liquidus 302 °C	Eutectic melting point of 183 °C
Alloy type	High-lead tin-lead alloy	Eutectic tin-lead alloy
Reflow sequence	Can remain solid during subsequent lower-temperature reflow	Melts at 183 °C
Selection basis	Assemblies specifying a high-melting-point joint	Assemblies specifying eutectic tin-lead solder

Frequently Asked Questions

Can Sn10Pb90 solder balls be used for ceramic BGA rework?

Yes. Sn10Pb90 solder balls can be used for ceramic ball grid array (CBGA) rework when the package or assembly specification requires a high-melting-point tin-lead joint. Confirm the specified alloy and rework requirements in the component documentation before selecting replacement solder balls.

Are Sn10Pb90 solder balls suitable for column grid array (CGA) rework?

Yes, when the CGA assembly specification calls for a high-melting-point tin-lead joint. Sn10Pb90 is an option for this application, but the required alloy should be confirmed against the component documentation and rework procedure.

Why is Sn10Pb90 used for hierarchical soldering?

Sn10Pb90 can be used in hierarchical soldering when a joint formed during an earlier assembly stage must remain solid during a later, lower-temperature reflow stage. Its higher melting range can support this process when the alloy selection and reflow profile meet the assembly requirements.

Additional Faqs

What size tolerance applies to Sn10Pb90 solder balls?

The maximum dimensional tolerance is ±4%. Typical measured tolerances vary by diameter: ±0.50% for 0.050–0.450 mm, ±1% for 0.500–0.550 mm, and ±0.83% for 0.600–0.889 mm. Sphericity deviation is less than 1.5%.

Do Sn10Pb90 solder spheres have lot traceability?

Yes. EasySpheres solder spheres have full lot traceability with QR-coded packaging, and a Certificate of Conformance is supplied with every shipment.

Which solder alloy is used for high-temperature ceramic BGA packages?

High-lead alloys such as Sn10Pb90 (268 to 302 °C) can be used for ceramic BGA packages where the specification calls for a high-melting tin-lead joint.

Can I order 0.600 mm (0.024 in) Sn10Pb90 solder spheres?

Yes. Sn10Pb90 solder spheres are available in a 0.600 mm (0.024 in) diameter. Refer to the Sn10Pb90 alloy page for the corresponding part number.

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.