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Solder Balls... Solder Spheres... Whatever you may call it, we think it is the perfect soldering package. We consider it the ultimate solder preform for solder attach, rework / reballing of PIP, POP, PBGA, or Flip Chip… The relative low cost and industry friendly nature of such rework processes eliminates costly waste and promotes environmental responsibility amongst our manufacturing sector. EasySpheres is here to help. For over 5 years, we have provided our industry with best in class soldering products with reasonable prices and World Class Service. Our breadth of alloy and sphere size offerings combined with our depth of inventory allows us to easily: show inventory, provide pricing, receive your order, fulfill your order, confirm your order and ship your order. EasySpheres is Easy…. After all, our name is our word.
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Found 8 product(s) for Solder Spheres . Click on product name to proceed (1-8 of 8)
EasySpheres Lead Free Solder Spheres are provided in many alloys, optimized to offer excellent wetting of lead free component and board finishes.
EasySpheres Solder Balls work with many existing flux technologies and form reliable, consistent, solder terminations which are free of oxide inclusions and yield minimal solder voids.
EasySpheres Lead Free Solder Spheres are provided in many alloys, optimized to offer excellent wetting of lead free component and board finishes.
EasySpheres Solder Balls work with many existing flux technologies and form reliable, consistent, solder terminations which are free of oxide inclusions and yield minimal solder voids.
EasySpheres Lead Free Solder Spheres are provided in many alloys, optimized to offer excellent wetting of lead free component and board finishes.
EasySpheres Solder Balls work with many existing flux technologies and form reliable, consistent, solder terminations which are free of oxide inclusions and yield minimal solder voids.
EasySpheres Lead Free Solder Spheres are provided in many alloys, optimized to offer excellent wetting of lead free component and board finishes.
EasySpheres Solder Balls work with many existing flux technologies and form reliable, consistent, solder terminations which are free of oxide inclusions and yield minimal solder voids.
EasySpheres Lead Free Solder Spheres are provided in many alloys, optimized to offer excellent wetting of lead free component and board finishes.
EasySpheres Solder Balls work with many existing flux technologies and form reliable, consistent, solder terminations which are free of oxide inclusions and yield minimal solder voids.
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
Tin(Sn)/ Lead(Pb) solders from EasySpheres are available with tin concentrations between 10% and 70% by weight. The greater the tin concentration, the greater the solder’s final tensile and shear strengths. The two most common Solder Sphere alloys used for rework, repair and substrate framing is Sn10Pb90 and Sn63Pb37, an alloy which is widely accepted as the premium industry standard for solder interconnection. While the tin provides tensile strength in the solder joint, the lead provides ductility and greatly assists in dampening the temperature coefficient differences (differences in rates of thermal expansion) present between two differing substrates.
