Copper Core Solder Spheres with Nickel Barrier Plating and Pure Tin Flash Plating - Product has been discontinued
Some limited inventory may remain in stock. Click Here to request stock check
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Some limited inventory may remain in stock. Click Here to request stock check
EasySpheres CUEZPL-XX solder spheres are sold in MOQ of 10,000 spheres and we can also accommodate high order quantities. Stock sizes ranges from 0.012" to 0.020" with stable 6 Sigma manufacturing standards for tight dimensional quality control.
| Features | Benefits |
| High Core melt Temp of 1080C | Precision Standoff Height |
| High Density Capable | Easy Substrate cleaning and encapsulation |
| Excellent Electrical Conductivity | 5 to 10 times that of Tin Lead Alloys |
| Superior Thermal Conductivity | Approx 1.3 times that of eutectic alloys |
Dimensional Tolerances for Plated Copper Core Spheres
| Core Dia. | Core Tolerance | Barrier Thickness (Ni) | Plating Thickness (Sn) |
| 300-490 µm | ± 15 µm | 2 µm | 23 µm |
| 500-600 µm | ± 25 µm | 2 µm | 23 µm |
Plating Thickness Specifications
* Nominal CU Core Diameter indicates approximate standoff height
| Download | Data Sheet |
| | EasySpheres Technical Data Sheet Plated Copper Core Data Sheet (2021-Rev3.pdf) |
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
There are no products listed under this category.