Copper Core Solder Spheres with - THIS PRODUCT has been discontinued
Some limited inventory may remain in stock. Click Here to request stock check
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Some limited inventory may remain in stock. Click Here to request stock check
CU100 Solid Copper Core Spheres are manufactured to the highest industry standards. With a ultra high melting temperature of 1080C, these non-collapsible spheres allow for very high package density, while maintaining nominal standoff height for easier cleaning and encapsulation. Our Spheres offer excellent electrical conductivity and superior thermal conductivity.
EasySpheres CU-100-XX solder spheres are sold in MOQ of 10,000 spheres and we can also accommodate high order quantities. Stock sizes ranges from 0.012" to 0.020" with stable 6 Sigma manufacturing standards for tight dimensional quality control.
| Features | Benefits |
| High Core melt Temp of 1080C | Precision Standoff Height |
| High Density Capable | Easy Substrate cleaning and encapsulation |
| Excellent Electrical Conductivity | 5 to 10 times that of Tin Lead Alloys |
| Superior Thermal Conductivity | Approx 1.3 times that of eutectic alloys |
Dimensional Tolerances for Copper Core Spheres
| Core Dia. (Inches) | Core Dia. (µm) | Dimensional Tol. | Part Number |
| 0.010" | 250µm | ± 15µm | in development |
| 0.012" | 300µm | ± 15µm | CU-100-12 |
| 0.014" | 350µm | ± 15µm | CU-100-14 |
| 0.016" | 400µm | ± 15µm | CU-100-16 |
| 0.018" | 450µm | ± 15µm | CU-100-18 |
| 0.020" | 500µm | ± 15µm | CU-100-20 |
| Download | Data Sheet |
| | EasySpheres Technical Data Sheet Copper Core Spheres (2021-Rev6.pdf) |
Copper Core Solder Spheres with no additional plating.
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