Copper Core Non Plated

  • Description & Specs.
  • Datasheets and SDS
Copper Core Solder Spheres.
EasySpheres Copper Core in Tape and Reel

 

 

 

CU100 Solid Copper Core Spheres are manufactured to the highest industry standards. With a ultra high melting temperature of 1080C, these non-collapsible spheres allow for very high package density, while maintaining nominal standoff height for easier cleaning and encapsulation. Our Spheres offer excellent electrical conductivity and superior thermal conductivity.

EasySpheres CU-100-XX solder spheres are sold in MOQ of 10,000 spheres and we can also accommodate high order quantities. Stock sizes ranges from 0.012" to 0.020" with stable 6 Sigma manufacturing standards for tight dimensional quality control.

 

 

 

 

Features Benefits
High Core melt Temp of 1080C

Precision Standoff Height

High Density Capable
Easy Substrate cleaning and encapsulation
Excellent Electrical Conductivity
5 to 10 times that of Tin Lead Alloys
Superior Thermal Conductivity
Approx 1.3 times that of eutectic alloys

Dimensional Tolerances for Copper Core Spheres

Core Dia. (Inches) Core Dia. (µm) Dimensional Tol. Part Number

0.010"

250µm

± 15µm

in development

0.012"

300µm

± 15µm

CU-100-12

0.014"

350µm

± 15µm

CU-100-14

0.016"

400µm

± 15µm

CU-100-16

0.018"

450µm

± 15µm

CU-100-18

0.020"

500µm

± 15µm

CU-100-20

Download Data Sheet

EasySpheres Technical Data Sheet Copper Core Spheres (2021-Rev6.pdf)

Copper Core Solder Spheres with no additional plating. 

Please Call: (858) 486-4068 for Custom Order Requirements

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