Copper Core Non Plated

Copper Core Solder Spheres with no additional plating. 

Please Call: (858) 486-4068 to Order and for Lead Time / Delivery




High Core melt Temp of 1080C Precision Standoff Height
High Density Capable Easy Substrate cleaning and encapsulation
Excellent Electrical Conductivity 5 to 10 times that of Tin Lead Alloys
Superior Thermal Conductivity Approx 1.3 times that of eutectic alloys
nonplated.pngCU100 Solid Copper Core Spheres are manufactured to the highest industry standards. With a ultra high melting temperature of 1080C, these non-collapsible spheres allow for very high package density, while maintaining nominal standoff height for easier cleaning and encapsulation. Our Spheres offer excellent electrical conductivity and superior thermal conductivity. 

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