Copper Core Solder Spheres with no additional plating.
|High Core melt Temp of 1080C||Precision Standoff Height|
|High Density Capable||Easy Substrate cleaning and encapsulation|
|Excellent Electrical Conductivity||5 to 10 times that of Tin Lead Alloys|
|Superior Thermal Conductivity||Approx 1.3 times that of eutectic alloys|
|CU100 Solid Copper Core Spheres are manufactured to the highest industry standards. With a ultra high melting temperature of 1080C, these non-collapsible spheres allow for very high package density, while maintaining nominal standoff height for easier cleaning and encapsulation. Our Spheres offer excellent electrical conductivity and superior thermal conductivity.