Sn63Pb37 Solder Balls
1. Choose a diameter. Every size listed is in stock.
2. Choose a quantity (minimum 10,000 spheres).
3. Add to cart to see your price.
In-stock orders placed by 2:00 PM Pacific ship the same day.
Volume pricing
Pricing steps down with quantity; at 1,000,000 spheres the discount against base price is 88%. For more than 5,000,000 spheres, ask for a custom quote.
Sn63Pb37 Technical Data Sheet (PDF)Sn63Pb37 stock diameters and part numbers (21 sizes)
| Diameter (mm) | Diameter (in) | Part number |
|---|---|---|
| 0.050 | 0.002 | 10-6337-02 |
| 0.080 | 0.0032 | 10-6337-032 |
| 0.100 | 0.004 | 10-6337-04 |
| 0.125 | 0.005 | 10-6337-05 |
| 0.150 | 0.006 | 10-6337-06 |
| 0.175 | 0.007 | 10-6337-07 |
| 0.200 | 0.008 | 10-6337-08 |
| 0.250 | 0.010 | 10-6337-10 |
| 0.300 | 0.012 | 10-6337-12 |
| 0.325 | 0.013 | 10-6337-13 |
| 0.350 | 0.014 | 10-6337-14 |
| 0.400 | 0.016 | 10-6337-16 |
| 0.450 | 0.018 | 10-6337-18 |
| 0.500 | 0.020 | 10-6337-20 |
| 0.559 | 0.022 | 10-6337-22 |
| 0.600 | 0.024 | 10-6337-24 |
| 0.635 | 0.025 | 10-6337-25 |
| 0.650 | 0.026 | 10-6337-26 |
| 0.700 | 0.028 | 10-6337-28 |
| 0.760 | 0.030 | 10-6337-30 |
| 0.890 | 0.035 | 10-6337-35 |
Order from 10,000 spheres. Other diameters from 0.050 to 0.889 mm on request. Also available in tape and reel, 0.300 to 0.760 mm.
Sn63Pb37 Solder Balls (Eutectic Tin-Lead)
Sn63Pb37 solder balls are the eutectic tin-lead alloy, melting at 183 °C, used for BGA rework, chip reballing, legacy and repair assemblies, and applications that specify tin-lead solder. EasySpheres supplies Sn63Pb37 solder spheres in multiple diameters and in tape and reel, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order.
Sn63Pb37 Solder Sphere Specifications
- Alloy: Sn63Pb37, eutectic tin-lead
- Applications: BGA rework and reballing, CSP ball attach, PCB repair, legacy and defense-related assemblies specifying tin-lead solder
- Melting point: 183 °C (eutectic)
- Stock diameters: 0.050 mm to 0.889 mm range; see the product listing for diameters and part numbers. Also available in tape and reel, 0.300 mm to 0.760 mm.
- Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%; inspection illuminance greater than 270 lux.
- Quality: Alloy purity in conformance with IPC J-STD-006 (composition per J-STD-006C); Certificate of Conformance ships with every order.
- Compliance: Leaded (tin-lead) alloy; not RoHS-compliant as supplied. Supply is not prohibited; REACH Article 33 disclosure available. Confirm that your application or exemption permits tin-lead solder before ordering.
- Packaging: Medical-grade, ESD-safe containers designed to resist the surface darkening caused by transit tumbling, reducing machine-vision faults in automated ball placement systems; QR-coded for lot conformance traceability and shipping accuracy.
- Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
- Minimum order: 10,000 spheres
Sn63Pb37 vs. SAC305 Solder Balls for BGA Rework
Sn63Pb37 and SAC305 solder spheres differ in melting temperature, lead content, and regulatory compliance. The appropriate alloy depends on the component and assembly specifications.
| Property | Sn63Pb37 | SAC305 |
|---|---|---|
| Alloy composition | 63% tin, 37% lead | 96.5% tin, 3.0% silver, 0.5% copper |
| Alloy type | Eutectic, leaded | Lead-free |
| Melting temperature | 183 °C | 217 °C solidus / 219 °C liquidus |
| RoHS compliance | Not RoHS-compliant as supplied | RoHS-compliant under Directive 2011/65/EU as amended |
| Typical selection | BGA rework and repair when tin-lead solder is specified | Assemblies requiring lead-free solder |
Select the alloy specified for the component and assembly. Sn63Pb37 and SAC305 have different thermal properties and lead content, so they should not be substituted without confirming process compatibility and applicable compliance requirements.
Frequently Asked Questions
What does eutectic mean in Sn63Pb37 solder?
Eutectic means an alloy melts and solidifies at a single temperature rather than over a temperature range. For Sn63Pb37, this temperature is 183 °C.
Can Sn63Pb37 solder be used for high-temperature applications?
Sn63Pb37 is used for standard BGA rework and repair when specified. For applications requiring a higher-melting joint, high-lead Sn10Pb90 has a melting range of 268–302 °C. Follow the applicable assembly specification when selecting an alloy.
Are Sn63Pb37 solder balls suitable for BGA reballing?
Yes. Sn63Pb37 is commonly used for reballing legacy and repair BGA packages when tin-lead solder is specified. Choose the sphere diameter according to the component package documentation.
Are Sn63Pb37 solder spheres used in aerospace and defense electronics?
Yes. Tin-lead alloys such as Sn63Pb37 are used in aerospace and defense assemblies when the applicable design and assembly specifications require them. Confirm the material requirements for the intended application.
What size tolerance applies to Sn63Pb37 solder balls?
The maximum dimensional tolerance is ±4%. Typical measured tolerances vary by diameter: ±0.50% for 0.050–0.450 mm, ±1% for 0.500–0.550 mm, and ±0.83% for 0.600–0.889 mm. Sphericity deviation is less than 1.5%.
Can I order 0.500 mm (0.020 in) Sn63Pb37 solder spheres?
Yes. Sn63Pb37 solder spheres are available in a 0.500 mm (0.020 in) diameter. See the stock diameter table on this page for the part number. The minimum order is 10,000 spheres.
Can I order 0.325 mm Sn63Pb37 solder spheres?
Yes. Sn63Pb37 solder spheres are available in a 0.325 mm diameter. See the stock diameter table on this page for the part number. The minimum order is 10,000 spheres.
