EasySpheres Sn20Pb80 Solder Balls are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers. Our solder balls are compliant to J-STD-006 and are QR coded for lot conformance traceability and shipping accuracy.
Alloy Melt Temperature : 183 - 280(°C)
Sn20Pb80 Leaded Solder Balls for BGA Rework & Semiconductor Packaging
Sn20Pb80 leaded solder balls are used for BGA rework, semiconductor packaging, PCB repair, and prototype applications. EasySpheres supplies precision tin-lead (SnPb) solder spheres for semiconductor packaging and rework, manufactured in conformance with IPC J-STD-006. As a high-lead alloy, Sn20Pb80 suits BGA chip reballing, PCB rework, legacy assemblies, and laboratory testing.
How to Choose Sn20Pb80 Leaded Solder Balls
- Applications: BGA repair, chip reballing, PCB rework, and semiconductor packaging.
- Alloy: Sn20Pb80 is high-lead tin-lead (SnPb) solder alloy (approximately 80% lead / 20% tin).
- Selection: Match the solder ball diameter to your BGA package and pad layout, and contact EasySpheres to confirm availability for your required alloy and size.
- Compliance: Manufactured in conformance with IPC J-STD-006, with a Certificate of Conformance shipped on every order and standard quality documentation available upon request.
EasySpheres warrants this product to be defect free, with a controlled size distribution per specification and an alloy purity which is in compliance of IPC-JSTD-006 guidelines. Size deviation shall not be greater than: ± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm) ± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm) ± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm) Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
