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Copper Core EZPlate
Copper Core Solder Spheres with Nickel Barrier Plating and Pure Tin Flash Plating.
Please Call: (858) 486-4068 to Order and for Lead Time / Delivery
 |
Feature |
Benefit |
|---|---|---|
| High Core melt Temp of 1080C | Precision Standoff Height | |
| High Density Capable | Easy Substrate cleaning and encapsulation | |
| Excellent Electrical Conductivity | 5 to 10 times that of Tin Lead Alloys | |
| Superior Thermal Conductivity | Approx 1.3 times that of eutectic alloys |
|
Copper Core EZPlate Solder Spheres are manufactured to the highest industry standards. With a protective Nickel flash plating, the copper core is protected in a gas tight barrier to prevent copper corrosion. Tin over-plating is then added to aid in the wetting of the sphere to standard tin lead solders. |
Dimensions and Specifications:
| Copper Core Diameter |
Core +/- |
Barrier (Ni) | Plating Thickness(Sn) |  |
|---|---|---|---|---|
| 300-490 µm | ± 15 µm | 2 µm | 23 µm | |
| 500-900 µm | ± 25 µm | 2 µm | 23 µm |
Product Availability:
EasySpheres CUEZPL-XX solder spheres are sold in MOQ of 10,000 spheres and we can also accommodate high order quantities.
Stock sizes ranges from 0.014" to 0.030" with stable 6 Sigma manufacturing standards for tight dimensional quality control.
* Nominal CU Core Diameter indicates approximate standoff height