EasySpheres CUEZPL-XX solder spheres are sold in MOQ of 10,000 spheres and we can also accommodate high order quantities. Stock sizes ranges from 0.012" to 0.020" with stable 6 Sigma manufacturing standards for tight dimensional quality control.
| Features | Benefits |
|
High Core melt Temp of 1080C
|
Precision Standoff Height |
|
High Density Capable
|
Easy Substrate cleaning and encapsulation
|
|
Excellent Electrical Conductivity
|
5 to 10 times that of Tin Lead Alloys
|
|
Superior Thermal Conductivity
|
Approx 1.3 times that of eutectic alloys
|
Dimensional Tolerances for Plated Copper Core Spheres
| Core Dia. | Core Tolerance | Barrier Thickness (Ni) | Plating Thickness (Sn) |
|
300-490 µm
|
± 15 µm
|
2 µm
|
23 µm
|
|
500-600 µm |
± 25 µm
|
2 µm
|
23 µm
|
Plating Thickness Specifications
* Nominal CU Core Diameter indicates approximate standoff height
| Download | Data Sheet |
|
|
EasySpheres Technical Data Sheet Plated Copper Core Data Sheet (2021-Rev3.pdf) |
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
