Copper Core Solder Spheres with Nickel Barrier Plating and Pure Tin Flash Plating.
|High Core melt Temp of 1080C||Precision Standoff Height|
|High Density Capable||Easy Substrate cleaning and encapsulation|
|Excellent Electrical Conductivity||5 to 10 times that of Tin Lead Alloys|
|Superior Thermal Conductivity||Approx 1.3 times that of eutectic alloys|
Copper Core EZPlate Solder Spheres are manufactured to the highest industry standards. With a protective Nickel flash plating, the copper core is protected in a gas tight barrier to prevent copper corrosion. Tin over-plating is then added to aid in the wetting of the sphere to standard tin lead solders.
Dimensions and Specifications:
|Copper Core Diameter||
|Barrier (Ni)||Finish Plating Thickness(Sn/Ag)(Sn/Pb) (Sn/Ag/Cu)|
|30-120 µm||5 µm||2 µm||5-50 µm|
|130-290 µm||10 µm||2 µm||5-50 µm|
|300-490 µm||15 µm||2 µm||5-50 µm|
|500-600 µm||15 µm||2 µm||5-50 µm|
|610-850 µm||20 µm||2 µm||5-50 µm|