Copper Core Solder Spheres with Nickel Barrier Plating and Pure Tin Flash Plating.
 |
Feature |
Benefit |
|---|---|---|
| High Core melt Temp of 1080C | Precision Standoff Height | |
| High Density Capable | Easy Substrate cleaning and encapsulation | |
| Excellent Electrical Conductivity | 5 to 10 times that of Tin Lead Alloys | |
| Superior Thermal Conductivity | Approx 1.3 times that of eutectic alloys |
|
Copper Core EZPlate Solder Spheres are manufactured to the highest industry standards. With a protective Nickel flash plating, the copper core is protected in a gas tight barrier to prevent copper corrosion. Tin over-plating is then added to aid in the wetting of the sphere to standard tin lead solders. |
Dimensions and Specifications:
| Copper Core Diameter |
Core +/- | Barrier (Ni) | Finish Plating Thickness(Sn/Ag)(Sn/Pb) (Sn/Ag/Cu) |
|---|---|---|---|
| 30-120 µm | 5 µm | 2 µm | 5-50 µm |
| 130-290 µm | 10 µm | 2 µm | 5-50 µm |
| 300-490 µm | 15 µm | 2 µm | 5-50 µm |
| 500-600 µm | 15 µm | 2 µm | 5-50 µm |
| 610-850 µm | 20 µm | 2 µm | 5-50 µm |
