Sn98.5Ag1Cu0.5

SAC105 Solder Balls (Sn98.5Ag1.0Cu0.5)

SAC105 (Sn98.5Ag1.0Cu0.5) solder balls are a low-silver, lead-free tin-silver-copper alloy used for BGA and CSP ball attach, BGA rework, and drop-shock-sensitive assemblies. EasySpheres supplies SAC105 solder spheres in a range of diameters for prototype and production applications, in conformance with IPC J-STD-006, with a Certificate of Conformance on every order.

SAC105 Solder Sphere Specifications

• Alloy: Sn98.5Ag1.0Cu0.5 (SAC105), lead-free
• Applications: BGA and CSP ball attach, BGA rework, drop-shock-sensitive assemblies
• Melting range: 215 °C solidus, 227 °C liquidus
• Stock diameters: 0.050 mm to 0.889 mm range; listed SAC105 diameters on this page run from 0.200 mm to 0.760 mm (11 sizes, part number series 10-1005)
• Dimensional tolerance: Maximum dimensional tolerance ±4% (typical measured ±0.50% for 0.050 to 0.450 mm, ±1% for 0.500 to 0.550 mm, ±0.83% for 0.600 to 0.889 mm); sphericity deviation less than 1.5%; inspection illuminance greater than 270 lux.
• Quality: Alloy purity in conformance with IPC J-STD-006 (composition per J-STD-006C); Certificate of Conformance ships with every order.
• Compliance: RoHS-compliant (Directive 2011/65/EU as amended by (EU) 2015/863) and REACH-compliant; declarations available on request.
• Packaging: Medical-grade, ESD-safe containers designed to resist the surface darkening caused by transit tumbling, reducing machine-vision faults in automated ball placement systems; QR-coded for lot conformance traceability and shipping accuracy.
• Shelf life: Two years from the date of shipment from the EasySpheres facility (product held sealed in controlled inert storage until shipped).
• Minimum order: 10,000 spheres