EasySpheres Blog

The correct solder ball size for BGA reballing is the diameter specified for the particular BGA package and reballing process. The required size depends on factors such as the package design, pad or l …read more

A continuation of our : ASK the Expert Series : Explore expert insights on intermittent BGA test issues and discover common solder joint defects and possible solutions. { …read more

Part of the ASK the Experts Series : Join our discussion on solder ball shelf life and get expert answers to your questions. Learn how to extend the life of your solder balls. …read more

ASK the Expert Series : Learn best practices for BGA reballing and repair from industry experts. Access valuable insights and gain from our experience with EasySpheres. { …read more

Explore how Circuit Technology Center excels in BGA rework and avoid common mistakes for higher product yield. These suggestions will increase your productivity and reduce scrapped product. …read more