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Sn95.5Ag3.8Cu0.7 (SAC 387) Solder Balls

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EasySpheres Sn95.5Ag3.8Cu0.7 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.

Alloy Melt Temperature : 217 - 219(°C)

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
± 0.010mm for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015mm for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020mm for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.