EasySpheres Sn9.5Ag3.8Cu0.7 Solder Balls are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers. Our solder balls are compliant to J-STD-006 and are QR coded for lot conformance traceability and shipping accuracy.
Alloy Melt Temperature : 217 - 219(°C)
EasySpheres warrants this product to be defect free, with a controlled size distribution per specification and an alloy purity which is in compliance of IPC-JSTD-006 guidelines. Size deviation shall not be greater than: å± 0.010mm for sizes .0.004" ~ 0.018" (0.100mm~0.450mm) å± 0.015mm for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm) å± 0.020mm for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm) Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.