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Sn97/Ag2.5/Cu0.5 Solder Spheres
EasySphere Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature : 221(°C)
Alloy Melt Temperature : 221(°C)
- Unit Quantity of 1 = 1,000 Spheres
- Orders for Unit Quantities of under 10 units will not be shipped
